When Microsoft redesigned the Xbox 360 motherboards with 65-nanometer chips to cut manufacturing costs they called it Falcon. Failure rates are down, but the problem isn't completely solved. When they do it again next year they'll call it Jasper.
That's the super secret news being broken by the Mercury News. For Microsoft, however, it is being seen as a cost-cutting measure and a way to address heat issues caused by the current graphics chip, said Mercury News tech blogger Dean Takahashi.
"Jasper is the code name for the next motherboard for the Xbox 360. It will be coming in August, in time for the holiday season. Jasper is going to have a 65-nanometer graphics chip from ATI Technologies, as well as smaller memory chips. That isn't much information, but it's enough to tell us about their cost-reduction plan and their solution to the 16-30% of Xbox 360 consoles that need to be sent in for repairs.
With the wild success of Nintendo's Wii currently dominating headlines, Takahashi said Jasper's release date should be moved up from August to an earlier date if possible. If you'll remember, Falcon's arrival coincided with a $50 Xbox 360 price cut. Microsoft declined comment other than to say it is always updating the components of the Xbox 360 but never comments on them directly.
We all know the reason why the Xbox 360s overheat is the excessive amount of heat created by the GPU, which causes the motherboard below it to warp and the chip itself to pop itself off the motherboard. The new jasper motherboard will clearly address that issue and finish what the falcon model started in bringing the 360 back to an average failure rate of 2-3%.
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