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Microsoft Licenses Bump-Map Algorithm

Bump-mapping, in case you're wondering, makes for a better looking game. And Microsoft just obtained the recipe.

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The next version of DirectX is taking shape. On Wednesday, Microsoft announced from the WinHEC 98 show in Orlando that it intends to license TriTech's Pyramid3D bump-mapping technology for future versions of the DirectX API, starting with DirectX 6.0.

In case you're not sure what bump-mapping is and why it is important to gamers, bump-mapping is a complex technique that allows graphics to emulate bumps, depressions, and other variations in a particular surface. For example, imagine looking at a brick in real life and seeing that it isn't perfectly flat, it has little nooks and crannies all over it. Bump-mapping allows for a map to define the look and depth of a particular area. This makes for a much more realistic view of anything that has different types of variations.

"By including a high-performance bump-mapping technique such as TriTech's in DirectX, we can provide a standard method for developers who want to begin exploiting this exciting new technology immediately," said Kevin Bachus, product manager for DirectX at Microsoft. "As a result of this license, consumers will see more realistic 3D graphics in their applications for Microsoft Windows; developers can be confident of widespread, consistent hardware support for bump-mapping; and hardware manufacturers can expect a large volume of new applications that will make use of bump-mapping effects."

Bettina Briz, vice president of marketing for TriTech, said, "Microsoft's selection of the Pyramid3D bump-mapping technology is a testimonial to our expertise in real-time 3D graphics. Bump-mapping enhances APIs to benefit software developers who are looking for their own product differentiation. This agreement highlights TriTech's ability to develop enabling technologies, as well as highly integrated products with value-added features."

TriTech introduced its Pyramid3D technology in 1997 as part of a strategy of making real-time bump-mapping available to low-cost 3D hardware.

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